For invisible marking, anti-counterfeiting or micro-device inspection/correction, laser machining is generally limited by diffraction to around 10 µm etching or marking. A french lab developed a technique using classical industrial nanosecond laser to achieve sub-wavelength etching and wants to develop an industrial station. With a German partner specialized in laser station construction, an industrial partner is searched as final user wishing to indentify/detect defects to submit a FTI project.

Reference: RDFR20180920001
Country: France
Submitted: Sep 21 2018
Updated: Oct 02 2018

Market: Equipment and instrumentation, Laser Related , Machine tools, other metal working equipment (excl. numeric control) , Semiconductors , Speciality metals (including processes for working with metals)
Technology: Erosion, Removal (spark erosion, flame cutting, laser, ..), Metals and Alloys , Micromachining, nanomachining , Optics , Surface treatment (painting, galvano, polishing, CVD, ..)
NACE: Other research and experimental development on natural sciences and engineering

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